澳门新葡亰平台官网

穆德魁
2018-07-20访问次数:

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个人概况:

穆德魁,博士,副教授,硕士生导师。2012年毕业于昆士兰大学获材料科学与工程博士学位,目前主要从事超硬材料的焊接机理及在工具制备领域的应用研究。


研究方向:

超硬材料焊接、电子封装、脆硬材料晶体结构与力学性能


研究领域:

钎焊


学习工作经历:

 学习经历:

1997-2001: 北京航空航天大学,机电一体化专业,本科。

2004-2008: 昆士兰科技大学 (Queensland University of Technology, Australia), 机械工程(Mechanical Engineering),学士(Bachelor),硕士 (M. Phil.)

2009-2012: 昆士兰大学 (The University of Queensland, Australia), 材料科学与工程 (Material Science and Engineering), 博士(2011年3月至2011年4月:交换学生,大阪大学(Osaka University, Osaka, Japan))。


 工作经历:

2012年11月-2013年7月: 博士后研究员,昆士兰大学 (The University of Queensland, Brisbane, Australia)

2013年8月至2014年6月: 研发工程师,斯培利亚 (Nihon Superior Co.,Ltd,Osaka,Japan)。

2014年9月至2015年8月: 讲师,江苏科技大学

2015年9月至今: 副教授,华侨大学

 

主持或参与的科研项目:

国家自然科学基金面上项目:活性软钎料低温连接金刚石磨粒关键技术的基础研究(2-17-2021),主持。

福建省科技厅引导性项目:钎焊金刚石用异质增强低温焊料的开发研究 (2018-2021),主持。

厦门市科技局产学研协同创新项目:钎焊微粉金刚石砂轮制备工艺(2018-2022)。主持。

华侨大学中青年教师科技创新资助计划(优秀青年科技创新人才)(2018-2022),主持。


主要论著与学术论文:

 期刊论文:

1. XJ Liao, QQ He, DK Mu*, H Huang, XP Xu, Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates, Solid State Phenomena 273 (2018) 181-186.

2. KY Feng, DK Mu*, XJ Liao, H Huang, XP Xu, Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy, Solid State Phenomena 273 (2018) 187-193.

3. Jinchang Chen, D. Mu*, Xinjiang. Liao, Guoqin. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60.

4. X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257.

5. D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20,55-76 (2016).Citation: 24.

6. D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).

7. D. Mu*, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).

8. D. Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).

9. D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).

10. D. Mu*, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).

11. K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).

12. D. Mu*, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).

13. G.Zeng, S.D. McDonald, D. Mu, K.Nogita, Y. Terada, H. Yasuda, Q.F. Gu, K, Nogita: Ni segregation in the interfacial (Cu, Ni)6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 21-27 (2014).

14. Y.F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics,143, 480-485 (2014).

15. Y. F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends. Metallurgical and Materials Transactions A, 34, 3184-3188 (2014).

16. Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society, 34, 2177-2185 (2014).

17. Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology, 249 208-211 (2013).

 会议论文:

1. Xinjiang Liao,D. Mu*,Hui Huang, Xipeng Xu: Wettability and interface reaction of Sn-Ti alloys on poly-crystalline diamond compact, EPITS 2017, Fukuoka, Japan, Nov, 2017.

2. D. Mu*, Kuiyuang Feng, Hui Huang, Xipeng Xu: Brazing sapphire/sapphire and sapphire/copper sandwich joints using Sn-Ag-Ti active solder alloy, EPITS 2017, Fukuoka, Japan, Nov, 2017 (invited).

3. D. Mu, Y. Sun and L. Ma, “Reliability of Multi-state Repairable Systems with Dependent Deteriorations”, Proceeding of Third Congress on Asset Management, Beijing, China, Oct.2008.

 


联系方式:

联系电话:15706175603

电子邮箱:dekui.mu@hqu.edu.cn; dekui.mu@uqconnect.edu.au


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