Hui HUANG, who currently is the Vice Department Chair of Institute of Manufacturing Engineering＆College of Mechanical Engineering and Automation in Huaqiao University. Currently, he is the Member of The International Committee for Abrasive Technology (ICAT) (Member of the International grinding Technology Committee), senior member of Chinese Mechanical Engineering Society, general secretary of Fujian Mechanical Engineering Society, the member of National Surface Finishing Committee, the editorial member of Diamond ＆Abrasives Engineering, and Superhard Material Engineering, the director of Xiamen Key Laboratory of Photoelectric Material Machining. He has been selected into the Ten Million Leading Talents Project of Fujian Province and the National Ten Million Leading Talents Project, New Century Excellent Talents Project Supported by Ministry of Education. He has enjoyed the Special Allowance of the State Council, and has been supported by Fujian Outstanding Youth Fund and Program for Changjiang Scholars and Innovative Research Team in University, and has received Fujian Yunsheng Youth Science and Technology Award. He has long been engaged in the teaching and research of brittle material processing and superhard material tools. He has won second prize of National Science and Technology Progress Award (the second winner) and 3 first prizes of provincial and ministerial scientific research awards. He has presided more than 10 scientific research projects which included 3 projects of National Natural Science Foundation of China, published more than 100 academic papers, among which more than 40 were retrieved by SCI and EI. Also, he has applied for 15 patents, and obtained 8 approvals including 4 invention patents.
1999~2002 Ph.D in Mechanical Engineering, Nanjing University of Aeronautics and Astronautics
1995~1998 M.S. in Mechanical Engineering, Huaqiao University
1991~1995 B.S. in Mechanical Engineering ,Huaqiao University
2010~Present Professor, Vice Department Chair, College of Mechanical Engineering and Automation＆Institute of Manufacturing Engineering, Huaqiao University
Mar.~Sept.,2012 Visiting Scholar, School of Mechanical and Mining Engineering, The University of Queensland （supported by China Scholarship Council ）
2004~2010 Associate Professor, College of Mechanical Engineering and Automation, Huaqiao University
2002~2004 Instructor, College of Mechanical Engineering and Automation, Huaqiao University
Ultrahard materials tools and its applications
Advanced processing technology for brittle materials
2013, Xipeng Xu, Hui Huang, Yuan Li, Hua Guo,etc., Key technology and application of diamond abrasive tools for stone efficient processing, second prize of National Science and Technology Progress Award.
2015, Xipeng Xu, Guoqin Huang, Hui Huang, Jianyun Shen,etc., Key technology and application of metal bond to firmly control diamond abrasive particles,first prize of Fujian Provincial Technological Invention Award.
2012,Xipeng Xu, Hui Huang, Yuan Li, Jianyun Shen,etc., Key technology and application of diamond abrasive tools for stone efficient processing, first prize of Science and Technology Progress Award of ministry of education
2008,Xipeng Xu,Yuan Li, Hui Huang, Jianyun Shen,etc., Basic research on diamond abrasive processing and tool technology of stone materials, first prize of Natural Science Award of ministry of education
1.2017-2020. Science and Technology Project of Fujian Province(Grant No. 2017H6014):“Development and Application of High-efficiency Precision Cutting tools for Single Crystal Silicon Carbide”
2.2014-2017. National Natural Science Foundation of China (Grant No. 51375179): “Fundamental Research of the Semiconductor Material wire saw with less cutting loss”
3.2011~2013. Science Fund for Distinguished Young Scholars of Fujian Province (Grant No. 2011J06021): “Research on the high-precision cutting technology for the single crystal SiC”
4.2010~2012. National Natural Science Foundation of China (Grant No. 50975099): “Research on the Vibration of Flexible Sawing with Diamond Wire and its Influence on the Wear of Diamond Beads”
5.2009~2011. New Century Excellent Talents in University from Ministry of Education of China (Grant No. NCET－08-0610)
6.2009~2011. New Century Excellent Talents in University from Ministry of Education of China (Grant No. NCET－08-0610)
Huang Hui, Qiu Yanfei et al. CN Patent # ZL 2016103652932, A new method to manufacture UV curable resin grinder with abrasive arranged in three-dimensional and its device.
Huang Hui, He Zhaobin et al. CN Patent # ZL 201310547047, A new device using to produce the continuous long brazing wire
Xu Xipeng, Liu Juan, Huang Hui, Yu Yiqing, CN Patent # ZL 200410041972.1 (Sep. 2004), A fabrication method of diamond polisihing film.
Huang Hui, Xu Xipeng, CN Patent # ZL 200620072360.3 (Apr. 2006), A new brazed diamond bead.
Xu Xipeng, Huang Hui, CN Patent # ZL 200620069106.8 (Jan. 2006) Brazed diamond disc.
Xu Xipeng, Huang Guoqing, Huang Hui, CN Patent # ZL 200720006734.6 (Apr. 2007), A kind of abrasives bead with large chip accommodation space.
Xu Xipeng, Huang Guoqing, Huang Hui, Li Yuan, CN Patent # ZL 200820103154.3 (Jul. 2008), Ultra-thin diamond segment with Grits optimized distributed
Fei Ma, Hui Huang*, Xipeng Xu. Material Removal Mechanisms of Cu-Co Metal-Powder Composite by Microorganisms, International Journal of Precision Engineering and Manufacturing-Green Technology, 2019.
Zhishu Lin, Hui Huang*, Xipeng Xu. Experimental and simulational investigation of wire bow deflection in single wire saw, International Journal of Advanced Manufacturing Technology, 2019, 101(1-4), 687-695.
Yanfei Qiu, Hui Huang*, Xipeng Xu. Effect of additive particles on the performance of ultraviolet-cured resin-bond grinding wheels fabricated using additive manufacturing technology, International Journal of Advanced Manufacturing Technology, 2018, 97(9-12), 3873-3882.
Haiyong Wu, Hui Huang, Xipeng Xu. The influence of crystallographic orientation on wear characteristics during single abrasive diamond grit scratching on sapphire, Industrial Lubrication and Tribology, 2018, 70, 1414-1421.
Jinchang Chen, Dekui Mu*, Xinjiang Liao, Guoqin Huang, Hui Huang, Xipeng Xu, Han Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy, International Journal of Refractory Metals & Hard Materials, 2018, 74, 52-60
Xuerun Huang, Hui Huang*, Hua Guo, Simulation and experimental research on the slicing temperature of the sapphire with diamond wire, International Journal of Computational Methods, 2017
Huang H , Li X , Xu X , et al. An experimental research on the force and energy during the sapphire sawing using reciprocating electroplated diamond wire saw. Journal of Manufacturing Science & Engineering, 2017, 139(12):121011-1~5.
Huang H , Wang S , Xu X. Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire，Materials Science in Semiconductor Processing, 2017, 71: 93~101.
He Z , Huang H , Yin F , et al. Development of a brazed diamond wire for slicing singlecrystal SiC ingots. The International Journal of Advanced Manufacturing Technology, 2017, 91(1-4):189-199.
Wu H , Huang H , Jiang F , Xu X. Mechanical wear of different crystallographic orientations for single abrasive diamond scratching on Ta12W，International Journal of Refractory Metals & Hard Materials, 2016, 54: 260-269.
Huang H , Zhang Y , Xu X. Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire，International Journal of Advanced Manufacturing Technology, 2015, 81(5-8):955~965.