Mar. 2009 - Nov. 2012: School of Mechanical and Minging Engineering, The University of Queensland (UQ), Brisbane, Australia, Ph.D. in Material Engineering.
Jul. 2004 - Nov. 2008: Faculty of Built Environment and Engineering, Queensland University of Technology (QUT), Brisbane, Australia, M. Phil. (Master By research) in Mechanical Engineering.
1.QUT Postgraduate Research Award (QUTPRA)
2.Australian Postgraduate Award (APA).
3.UQ Graduate School International Travel Award (GSITA)
4.The Best Published Material Award (UQ Postgraduate Engineering Conference 2012)
1.Interface reaction and solidification during brazing and soldering process.
2.Microstructure and mechanical responses of filler and solder alloys.
1.National Natural Science Foundation of China (Grant Nos.: 51675191).
2.Promotion Program of Development and Application of Natural Science of Fujian Province (2018H0023),
3.Industrial linkage Collaborative Innovation Project of Xiamen City (3502Z20183020).
4.Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University.
1.D. Mu*, K.Y. Feng, Q.L. Lin, H. Huang, Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, in press.
2.X.J. Liao, D. Mu*, W. Fu, H. Huang, H. Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039.
3.J. Shen, L. Li, X. Wu, H. Chen, W.Z. Huang, D. Mu: Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process, International Journal of Refractory Metals and Hard Materials, 84 (2019) 104973.
4.M Li, J Chen, Q Lin, Y Wu, D Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440.
5.J. Chen, X. Liao, Q. Lin, D. Mu*, H. Huang, X. Xu. H. Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99.
6.J. Chen, D. Mu*, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60.
7.X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257.
8.D. Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20，55-76 (2016).
9.G. Zeng, S.D. McDonald, D. Mu, K.Nogita, Y. Terada, H. Yasuda, Q.F. Gu, K, Nogita: Ni segregation in the interfacial (Cu, Ni)6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 21-27 (2014).
10.Y. F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics,143, 480-485 (2014).
11.Y. F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends. Metallurgical and Materials Transactions A, 34 (2014) 3184-3188.
12.Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society, 34, 2177-2185 (2014).
13.D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).
14.D. Mu*, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).
15.Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology, 249 208-211 (2013).
16.D. Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).
17.D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).
18.K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).
19.D. Mu*, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).
20.D. Mu*, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).
Selected conference articles:
1.X.J. Liao, Q.Q. He, D. Mu*, H Huang, XP Xu, Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates, Solid State Phenomena 273 (2018) 181-186.
2.K.Y. Feng, D. Mu*, XJ Liao, H Huang, XP Xu, Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy, Solid State Phenomena 273 (2018) 187-193.
3.D. Mu, Y. Sun and L. Ma, “Reliability of Multi-state Repairable Systems with Dependent Deteriorations”, Proceeding of Third Congress on Asset Management, Beijing, China, Oct., 2008.